Asahi Kasei Wah Lee Hi-Tech Corp. Completes New High-Resolution Dry Film Photoresist Plant; Wah Lee and Asahi Kasei Strengthen Advanced Packaging Material Supply Chain

Bussiess News

2026-07-15

Driven by the rapid growth of artificial intelligence (AI), high-performance computing (HPC), and advanced semiconductor packaging, the semiconductor materials supply chain is entering a new phase of capacity expansion. Asahi Kasei Wah Lee Hi-Tech Corp. (AKWL), a joint venture established in 1997 by Japan's Asahi Kasei and Taiwan's Wah Lee, recently held the completion ceremony for its second high-resolution dry film photoresist processing plant, officially launching a new phase of production capacity expansion.

Upon full operation, the new facility will double AKWL's overall production capacity, significantly enhancing its ability to supply high-resolution dry film photoresists for advanced semiconductor packaging and high-end IC substrate applications.

Speaking at the inauguration ceremony, the Chairman of Wah Lee stated that the expansion is a strategic response to the growing demand driven by AI, advanced printed circuit boards (PCBs), and IC substrates. The completion of the new plant not only demonstrates the company's confidence in the market outlook and commitment to its customers, but also marks the beginning of its next stage of growth. Going forward, Wah Lee will continue to leverage its extensive market expertise and global network to create new business opportunities together with Asahi Kasei.

In recent years, the rapid deployment of AI servers, generative AI applications, and cloud data centers has significantly increased demand for high-end chips, including AI GPUs, ASICs, and high-bandwidth memory (HBM). This trend has further accelerated growth in the ABF substrate market. According to market research firms and international financial institutions, the global supply-demand imbalance for ABF substrates—produced by leading manufacturers such as Unimicron, Nan Ya PCB, and Kinsus—is expected to persist through 2028. Consequently, the supply of critical materials for high-end substrates is becoming increasingly constrained, with high-resolution dry film photoresists playing a pivotal role in achieving superior manufacturing yield and process precision for advanced semiconductor packaging.

Wah Lee has long been deeply involved in the semiconductor and electronic materials industry and has served as the distributor of Asahi Kasei's high-resolution dry film photoresists for many years. Its customer base includes all major domestic ABF substrate manufacturers. The products have been successfully qualified by multiple leading customers and have secured substantial production orders. As next-generation AI chips continue to evolve toward larger package sizes and higher layer-count designs, demand for finer circuit patterns and higher material quality continues to rise, driving robust growth in the high-resolution dry film photoresist market. Revenue from these products has maintained strong double-digit annual growth in recent years.

In addition, Wah Lee is actively expanding its presence in other high-growth sectors, including AI server boards, optical communication modules, and low Earth orbit (LEO) satellite applications. Due to the stringent requirements for extreme temperature resistance, vibration durability, and long-term operational reliability in satellite communication equipment, Asahi Kasei's high-resolution dry film photoresists have successfully entered the global LEO satellite PCB supply chain. As customers continue to expand overseas production, the company is further strengthening its global market presence.

Looking ahead, Wah Lee will continue to collaborate closely with Asahi Kasei to deepen its portfolio of advanced materials, enhance localized supply capabilities and technical support services, and help customers seize the opportunities created by the rapid advancement of AI and high-performance computing. Together, the two companies aim to build a more resilient and competitive global semiconductor materials supply chain.