RayTRONS (豐鵬電科)

Raytrons Energy was founded in 2019 and has its power technology research and development center in Taiwan that under Hong Kong-based mother company Raytrons. Raytrons has excellent thermal conductivity technology for power substrates, and uses its power substrate with next-generation (WBG) power transistors and patented architecture to meet high-power-density half-bridge SiP products, which are applied to high-frequency/high-density/high-efficiency power supplies. Raytrons has extensive expertise in thermal management solutions. Its products are widely used in automotive, high-power LED lighting, UV/IR, IGBT, SiC power modules and power electronics. It possesses the development of AMB technology in ceramic substrates.

GaN SiP:
*Using the third generation semiconductor GaN as the internal switch component of the module
*Patented vertical dual power loop design
*Patented high thermal conductivity QFN-SiP design to optimize thermal resistance
*Easy thermal conductivity design
*Easy production and assembly

AMB Substrate:
In order to meet the use function and working environment of ceramic substrate, the technical requirements of copper cladding process are as follows:
*Thermal conductivity requirements: copper and ceramic substrate brazing 100% compactness, no cavity;
*Reliability requirements: high welding strength, no cracking or failure in the specified number of cold and heat cycles;
*Voltage level requirements: suitable ceramic board thickness and circuit gap width, circuit gap groove bottom etched clean, meet the required insulation strength.
*Surface treatment requirements: ensure the solderability and oxidation resistance of copper conductor. Ensure to meet the ultrasonic bonding strength of aluminum wire.

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